Automotive, mobility
The Lancet’s Road Safety 2022 Report estimates that 1.35 million people die each year in traffic accidents, and more than 50 million are injured or disabled. Low-income and middle-income countries (LMICs) have the most deaths, accounts for 93% of the world’s fatalities on roads. The four main risk factors for road injuries are speeding, drink-driving (drunk driving), not wearing a helmet (for motorcycles) and not wearing seat belts or child seats.
The global automotive chip market will be worth US$92.21 billion by 2026, up from US$52.53 billion in 2021, according to ReportLinker† According to the report, the major players in the global automotive chip market are: NXP† Infineon technologies, Renesas† STMicroelectronics† ROHM Semiconductor† Toshiba Corporation† Robert Bosch† Qualcomm† Microchip technology† OP Semiconductor† NVIDIA† Texas Instrumentsand Analog Devices (Maximum integrated).
Renesas and AI chip maker Hello working together on a hardware combination for automotive automation systems — the ADAS (Advanced Driver Assistance Systems) and ADS (Automatic Driving Systems). The companies will combine Hailo-8 processors to accelerate neural networks with Renesas’ R-Car V3H & R-Car V4H systems-on-chip (SoCs). The solutions scale from ADAS L2+ to L4 AD functions, for zonal and centralized vehicle ECUs.
Cadence debut two new DSP IP cores in its Tensilica ConnX family of radar, lidar and communications DSPs, targeting automotive, consumer and industrial markets. Tensilica ConnX 110 (128 bit) and ConnX 120 (256 bit) DSPs have an N-way programming model. The DSPs are supported by complex math library functions in the NatureDSP, Eigen, and Radar libraries. The ConnX 120 offers Viterbi and Turbo decoders. The ConnX DSPs are car ready and fully compliant with ISO 26262 compliant ASIL-D with FlexLock or ASIL-B.
Cadence also announced its Xcelium Apps portfolio, which run natively on Cadence’s Xcelium Logic Simulator kernel for automotive, mobile, and hyperscale design teams. Apps include Xcelium Machine Learning, Mixed-Signal, Multi-Core, Safety, Power Playback, and X-Pessimism Removal. That last app is about reducing debug time using algorithms “to make the distribution of ‘X’ values in simulation more accurate.”
Bus and Truck Manufacturer scania will use Keysight‘s Scienlab Battery Test Solutions for its new state-of-the-art battery laboratory at its new research and development facilities in Södertälje, Sweden. The facility will test battery technology for EVs. Scania is part of the Volkswagen Group†
Renesas works with Tata Group businesses Tata Motors Ltd. (TML) and Tejas Networks in India to develop automotive electronics, especially for EVs and connected vehicles. Tejas and Renesas will collaborate on wireless network hardware, such as radio units.
Pervasive Computing
CEVA and Flex Logic created a silicon implementation of the CEVA-X2 DSP who can change his instruction set† The silicon implementation, an ASIC called the CEVA SOC2, uses Flex Logix’s EFLX embedded FPGA (eFPGA) connected to a CEVA-X2 DSP instruction extension interface. Bar-Ilan University SoC Labwho is a member of the HiPer Consortiumbacked by the publicly funded Israeli Innovation Authority (IIA), designed and pasted from the SOC2 for TSMC 16 nm technology. “The SOC2 contains two processing clusters, each with two CEVA-X2 DSP cores and EFLX eFPGA for programming and executing DSP instruction extensions, connected using the CEVA-Xtend mechanism. Flex Logix and CEVA’s mutual customers can now confidently use custom instructions to get more value from their ASIC by targeting different DSP applications in addition to communications and audio with customizable ISA post-production,” said Erez Bar-Niv , CTO of CEVA, said in a press release†
Infineon acquired verification expert No Bug in Romania and Serbia to strengthen its IoT product development team, the Connected Secure Systems (CSS) Division.
Synopsys optimized design and verification tools and IP for the last Arm v9 architecture-based SoCs, the Cortex-A715, Cortex-A510, and Cortex-X3 CPUs, and Immortalis-G715, Mali-G715, and Mali-G615 gaming-optimized GPUs. Synopsys’ Digital Design Family, Verification Family and Interface IP (controllers and PHYs) in the form of QuickStart Implementation Kits (QIKs) for 5, 4 and 3nm help early adopters achieve PPA goals, according to a press release† The Arm v9 SoCs are used in mobile applications in laptops, smartphones, gaming and augmented/virtual reality.
Cadence also cooperates Arm to optimize tools for Arm Total Compute Solutions 2022 (TCS22), namely the Arm Cortex-A715 and Cortex-X3 CPUs and the Arm Mali-G715 and Immortalis-G715 GPUs. Cadence provided RTL-to-GDS digital stream Rapid Adoption Kits (RAKs) for 5nm and 7nm nodes.
Siemens and NVIDIA are connecting the Siemens Xcelerator, the open digital business platform with physics-based digital models, and NVIDIA Omniverse, a 3D design and collaboration platform, for use in industrial environments. The goal is to enable customers of all sizes to create digital twins with real-time data and software-defined AI systems. The platforms provide ways to create industrial IoT systems and help customers gain insight from analytics. Siemens Digital Industries software recently announced that it is expanding His Xcelerator platform will be useful to all businesses that need to bring physical and digital worlds together by helping to break down the silos between operations technology (OT) and information technology (IT) teams.
Infineon launched a battery powered AI/ML based acoustic event detection and sensor fusion alarm system.
Renesas and supplier of embedded speech systems Cyberon convert voice user interface (VUI) interface to Renesas RA MCU line. The VUI supports more than 40 global languages. RA MCU users can access Cyberon’s VUI toolchain. Renesas is developing a Voice Reference Hardware Platform for prototyping speech interfaces. The platform does not require a network connection to Cyberon’s DSpotter tool, which has a phoneme-based modeling approach. Other features include power-saving Voice Activity Detection (VAD), Voice Audio Playback, and (VAP) to enable voice input and voice responses, among other features.
Canon used AMD‘s Versal AI Core series, with AMD AI Engine technology, to process 3D video images in real time for Canon’s Free Viewpoint video system used in sports broadcasts. The video system gives viewers access to different camera angles and the ability to slow down the video.
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